Process Capacity
1-38 layers PCB
Surface treatment
Unlead solder leveling
HASL
Gold plating
Chemical gold( >=4 microinch)
Selective Gold Dry Film Lamination
(OSP) Surface treatment
Production cycle
production capacity: 35000 m2/month
| Double-side boards | Multi-layer boards | |
|---|---|---|
| Sample | 3-5 days | 5-7 days |
| New order | 7-9 days | 8-11 days |
| Repeat order | 5-7 days | 7-9 days |

