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Home > Products > FPC > Flexible PCBs > flexible pcbs 4-Layer High-Heat Ceramic FPC flex circuits for Aerospace fpc board

flexible pcbs 4-Layer High-Heat Ceramic FPC flex circuits for Aerospace fpc board

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Item	Specifictions	Item	Specifictions
Regular Base Materials	Kapton,Polyimide(PI),Polyester(PET),PC	Outline Fabrication	Die cut,laser cut,CNC routing,V-scoring
Layer Count	FPC:1-6 Layers;Rigid Flex:2-10 Layers	Min.Line Width/Spacing	0.04mm/0.04mm
Regular Base Material Thickness	FPC:12.5μm-50μm;Rigid:0.1mm-3.2mm	Blind or Buried Vias	Yes
Copper Thickness	1/3oz-6oz	Impedance Control	Yes
Surface Finish	Electroplate Ni/Au(Flash gold/Soft gold/Hard gold),ENIG,Immersion Tin,plated sliver,immersion silver,OSP,HASL	Testing	Electrical Test
Regular Thickness	Coverlay:27-50μm;Adhesive:12-25μm	Certification	ISO9001 / UL /ISO14001/IATF16949/ RoHS

Standard FPC Production Flow:

Cutting→ Drilling→ PTH → Copper Plating → Pre-treatment → Dry Film Lamination → Exposure→ Developing→ Etching→

Stripping → Surface Treatment→ Coverlay Lamination → Stiffener Attachment → Baking→ Silkscreen → E-test →

Punching/Laser Cutting → FQC → Packaging

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Xing Da Electric Technology Co., Ltd