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Home > Products > FPC > Flexible PCBs > flexible pcbs 4-Layer High-Heat Ceramic FPC flex circuits for Aerospace fpc board

flexible pcbs 4-Layer High-Heat Ceramic FPC flex circuits for Aerospace fpc board

  • Place of origin: China
  • Material: Polyimide, Copper foil
  • Board thickness: 0.05mm- 0.50mm
  • Offer:
  • Range of copper thickness: 1/3 oz - 2 oz
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Detail Specification

Item

Specifictions

Item

Specifictions

Regular Base Materials

Kapton,Polyimide(PI),Polyester(PET),PC

Outline Fabrication

Die cut,laser cut,CNC routing,V-scoring

Layer Count

FPC:1-6 Layers;Rigid Flex:2-10 Layers

Min.Line Width/Spacing

0.04mm/0.04mm

Regular Base Material Thickness

FPC:12.5μm-50μm;Rigid:0.1mm-3.2mm

Blind or Buried Vias

Yes

Copper Thickness

1/3oz-6oz

Impedance Control

Yes

Surface Finish

Electroplate Ni/Au(Flash gold/Soft gold/Hard gold),ENIG,Immersion Tin,plated sliver,immersion silver,OSP,HASL

Testing

Electrical Test

Regular Thickness

Coverlay:27-50μm;Adhesive:12-25μm

Certification

ISO9001 / UL /ISO14001/IATF16949/ RoHS


Application Scenarios


FPC Production Line

Standard FPC Production Flow:

Cutting→ Drilling→ PTH → Copper Plating → Pre-treatment → Dry Film Lamination → Exposure→ Developing→ Etching→

Stripping → Surface Treatment→ Coverlay Lamination → Stiffener Attachment → Baking→ Silkscreen  → E-test  → 

Punching/Laser Cutting → FQC → Packaging


Contact Us

Contact us for any help regarding FPC:

Website: www.xdpcba.com

Email: sales@xdpcba.com; sales4@xdpcba.com


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