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Home > Products > PCB > Special PCB > 4-Layer HDI PCB for RFID High-Gain RF Interconnect Solution

4-Layer HDI PCB for RFID High-Gain RF Interconnect Solution

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HDI PCB Process Specification

Process Specification

1. Enhanced Range: 4-layer shielding for superior RF signal gain.

2. Compact Layout: High-density micro-vias for small-footprint designs.

3. Low Interference: Optimized stack-up for minimized EMI/EMC noise.




HDI PCB Application scenarios

1.Smartphone Mainboard

HDI PCB adopts blind and buried vias for high-density routing, supporting compact layout and high-speed signal 

transmission for flagship smartphones. 


2.Smart Watch & Wearables 

Ultra-fine HDI PCB minimizes board dimension, integrating sensors, Bluetooth and power management for miniaturized, 

low-power wearable devices.


3.Automotive Electronics

Automotive-grade HDI PCB serves infotainment, instrument and radar modules, delivering high-density interconnection 

with anti-vibration and wide-temperature stability.


4.Laptop & Tablet Mainboard 

Thin-type HDI PCB enables high-speed interconnection among CPU and memory, realizing component dense layout 

for slim, high performance portable devices.




HDI PCB Production Line


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Email: sales1@xdpcba.com

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sales@xdpcba.com

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