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6-Layer HDI Antenna PCB High-Frequency RF Signal Interconnect

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HDI PCB Process Specification

Process Specification

1. High Gain: Optimized 6-layer stack-up for maximum RF signal reach.

2. Low Loss: High-frequency materials ensure minimal signal attenuation.

3. Anti-Interference: Advanced HDI shielding for pure data transmission.

HDI PCB Application scenarios

1.Smartphone Mainboard

HDI PCB adopts blind and buried vias for high-density routing, supporting compact layout and high-speed signal

transmission for flagship smartphones.

2.Smart Watch & Wearables

Ultra-fine HDI PCB minimizes board dimension, integrating sensors, Bluetooth and power management for miniaturized,

low-power wearable devices.

3.Automotive Electronics

Automotive-grade HDI PCB serves infotainment, instrument and radar modules, delivering high-density interconnection

with anti-vibration and wide-temperature stability.

4.Laptop & Tablet Mainboard

Thin-type HDI PCB enables high-speed interconnection among CPU and memory, realizing component dense layout

for slim, high performance portable devices.

HDI PCB Production Line

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