| FPC Tech Specification | |
| Items | Capabilities |
| Layers | FPC：1 to 6 Layers，Rigid Flex：2 to 10 Layers |
| Regular Base Materials | Kapton，Polyimide（PI），Polyester（PET），FR4 |
| Base Copper Thickness | 1/3 oz to 6oz |
| Regular Base Material Thickness | 12.5um to 50um（FPC） |
| 0.1mm to 3.2mm（Rigid） | |
| Regular Coverlay Thickness | 27um to 50um |
| Regular Adhesive Thickness | 12um to 25um |
| Blind or Buried Vias | Yes |
| Impedance Control | Yes |
| Min.Line Width/Spacing | 0.04mm/0.04mm |
| Surface Finishing | Electroplate Ni/Au（Flash gold/Soft gold/Hard gold），ENIG，Immersion Tin，O.S.P |
| Outline Fabrication | Die cut，laser cut，CNC routing，V-scoring |
| Hole to edge(Hard tool/Die Cut) | ±0.1/±0.2mm |
| Edge to edge(Hard tool/Die Cut) | ±0.05/±0.2mm |
| Circuit to edge(Hard tool/Die Cut) | ±0.07/±0.2mm |
| Aluminium Tech Specification | |
| Item |
|
| Type of Alum board | single board, Insulation board, double sided board |
| Finish Board Thickness | 0.4mm----- 3.0mm |
| Copper Thickness | 1 OZ--6 OZ |
| Min.Trace Width & Line Spacing | 0.15mm |
| Biggest size | 120cm*60cm |
| Type for surface treatment | OSP.HASL, Immersion Gold ,Immersion Tin (lead free) |
| OSP | 0.20-0.40um |
| Thickness of Ni | 2.50-3.50um |
| Thickness of Au | 0.05-0.10um |
| Thickness of tin | 5-20um |
| Thickness of immersion silver | 0.15-0.40um |
| Thermal conductivity | 1.0W-----3.0W |
| Dielectric Thickness | 50um-150um |
| Thermal resistance | 0.05℃/W-1.7℃/W |
| Minimum completed hole dimension | ±0.10mm |
| Tolerance for Hole Diameter | ±0.075mm |
| Minimum Drilling Hole Diameter | φ0.8mm |
| Mask between pins | 0.15mm-0.35mm |
| Minimum spacing between Pad and Pad | 0.18mm-0.35mm |
| Outline tolerance | ±0.10mm |
| Minimum thickness for V-cut | 0.25mm |
| Outside copper thickness | 18-105um |
| Core copperthickness | 18-35um |
| PCB Manufacture Capacity | |
| Item | Specification |
| Material | FR-4, FR2.Taconic, Rogers, CEM-1, CEM-3, Ceramic, Crockery, Metal-backed Laminate, etc. Aluminum |
| Remarks | High Tg CCL is Available(Tg>=170℃) |
| Finish Board Thickness | 0.2 mm-6.00mm(8mil-126mil) |
| Surface Finish | Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um) |
| Shape | Routing、Punch、V-cut、Chamfer |
| Surface Treatment | Solder Mask(black, green, white, red, blue, thickness>=12um, Block, BGA) |
| Silkscreen(black, yellow, white) | |
| Peel able-mask(red, blue, thickness>=300um) | |
| Minimum Core | 0.075mm(3mil) |
| Copper Thickness | 1/2 oz min; 12oz max |
| Min Trace Width & Line Spacing | 0.075mm/0.1mm(3mil/4mil) |
| Min Hole Diameter for CNC Drilling | 0.1mm(4mil) |
| Min Hole Diameter for Punching | 0.6mm(35mil) |
| Biggest panel size | 610mm * 508mm |
| Hole Position | +/-0.075mm(3mil) CNC Drilling |
| Conductor Width(W) | +/-0.05mm(2mil) or +/-20% of original |
| Hole Diameter(H) | PTHL:+/-0.075mm(3mil) |
| Non PTHL:+/-0.05mm(2mil) | |
| Outline Tolerance | +/-0.1mm(5mil) CNC Routing |
| Warp & Twist | 0.70% |
| Insulation Resistance | 10Kohm-20Mohm |
| Conductivity | <50ohm |
| Test Voltage | 10-300V |
| Panel Size | 110 x 100mm(min) |
| 660 x 600mm(max) | |
| Layer-layer misregistration | 4 layers:0.15mm(6mil)max |
| 6 layers:0.25mm(10mil)max | |
| Min spacing between hole edge to circuitry pattern of an inner layer | 0.25mm(10mil) |
| Min spacing between board outline to circuitry pattern of an inner layer | 0.25mm(10mil) |
| Board thickness tolerance | 4 layers:+/-0.13mm(5mil) |