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Home > Products > PCB > Ceramic PCB > ENIG ceramic substrate ceramic printed circuit board DPC ceramic copper plating thick copper alumina circuit board hole filling pcb plate

ENIG ceramic substrate ceramic printed circuit board DPC ceramic copper plating thick copper alumina circuit board hole filling pcb plate

  • Place of origin: China
  • Material: Alumina, Alumina Ceramic, Ceramic
  • Board thickness: 0.2mm-6mm
  • Offer: Leave your email to receive a discount coupon – we'll send it to you right away.
  • Range of copper thickness: 0.5oz-12oz(18μm - 420μm)
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Product Details


1. Key Features of Ceramic Substrate PCB

l Excellent Thermal Conductivity

Ceramic PCB provides outstanding heat dissipation performance, helping efficiently transfer heat away from high-power components and improving product reliability.

 

l Superior Electrical Insulation

The ceramic substrate offers excellent dielectric properties and stable electrical insulation, making it suitable for high-voltage and high-power electronic applications.

 

l High Temperature Resistance

With excellent thermal stability and a low thermal expansion coefficient, ceramic PCB maintains reliable performance under harsh operating environments.

 

l Advanced Ceramic Metallization Technology

Using DPC (Direct Plated Copper) technology, copper layers are directly bonded with ceramic substrates to achieve excellent thermal and electrical performance.

 

l High Reliability for Power Electronics

Ceramic substrate PCB supports high current applications and provides long-term stability for power modules, semiconductor devices and automotive electronics.

 

l Customized Ceramic PCB Solutions

Customized ceramic PCB designs are available according to different material requirements, dimensions, copper thickness and application conditions.

 

2. Production Process:

Specifications

Material

Aluminium nitride Ceramic /Alumina 99.5%/Alumina 99%

average crystal size

3-5um

volume density

≧3.74g/cm³

Vickershardness

≧15Gpa

flexural Strength

≧324Mpa

Linear Coefficient of Thermal
Expansion

605-7.56.5-8.0 1×10-˚mm/℃

thermal conductivity

≧170W(m-k)

Dielectric intensity

≧12Kv/mm

Volume Resistance

≧1014≧1011≧109Ω-cm

Dielectric Constant

9.3-10.6

dielectric loss

3×10-4

Thermal-shock

≧7times

roughness of the surface

0.20-0.75μm

Product highlights:

DPC alumina & aluminum nitride ceramic copper plating processing (surface copper max: 210um, hole filling aspect ratio max5:1)

 

3. PCB Manufacturing Process

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4. Key Specifications

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Attention: pictures are for reference only. The specific products are subject to the original factory model. 

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5. Contact Us

Contact us for any help regarding ceramic PCB.

Website: www.xdpcba.com
Email: sales@xdpcba.com; Bluesky@xdpcba.com


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