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ENIG ceramic substrate ceramic printed circuit board DPC ceramic copper plating thick copper alumina circuit board hole filling pcb plate

Place of origin: China
Material: Alumina, Alumina Ceramic, Ceramic
Board thickness: 0.2mm-6mm
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Range of copper thickness: 0.5oz-12oz(18μm - 420μm)

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Product Details

1. Key Features of Ceramic Substrate PCB

l Excellent Thermal Conductivity

Ceramic PCB provides outstanding heat dissipation performance, helping efficiently transfer heat away from high-power components and improving product reliability.

l Superior Electrical Insulation

The ceramic substrate offers excellent dielectric properties and stable electrical insulation, making it suitable for high-voltage and high-power electronic applications.

l High Temperature Resistance

With excellent thermal stability and a low thermal expansion coefficient, ceramic PCB maintains reliable performance under harsh operating environments.

l Advanced Ceramic Metallization Technology

Using DPC (Direct Plated Copper) technology, copper layers are directly bonded with ceramic substrates to achieve excellent thermal and electrical performance.

l High Reliability for Power Electronics

Ceramic substrate PCB supports high current applications and provides long-term stability for power modules, semiconductor devices and automotive electronics.

l Customized Ceramic PCB Solutions

Customized ceramic PCB designs are available according to different material requirements, dimensions, copper thickness and application conditions.

2. Production Process:

Specifications

Material	Aluminium nitride Ceramic /Alumina 99.5%/Alumina 99%
average crystal size	3-5um
volume density	≧3.74g/cm³
Vickershardness	≧15Gpa
flexural Strength	≧324Mpa
Linear Coefficient of Thermal Expansion	605-7.56.5-8.0 1×10-˚mm/℃
thermal conductivity	≧170W(m-k)
Dielectric intensity	≧12Kv/mm
Volume Resistance	≧1014≧1011≧109Ω-cm
Dielectric Constant	9.3-10.6
dielectric loss	3×10-4
Thermal-shock	≧7times
roughness of the surface	0.20-0.75μm

Product highlights:

DPC alumina & aluminum nitride ceramic copper plating processing (surface copper max: 210um, hole filling aspect ratio max5:1)

3. PCB Manufacturing Process

4. Key Specifications

Attention: pictures are for reference only. The specific products are subject to the original factory model.

5. Contact Us

Website: www.xdpcba.com
Email: sales@xdpcba.com; Bluesky@xdpcba.com

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Xing Da Electric Technology Co., Ltd

ENIG ceramic substrate ceramic printed circuit board DPC ceramic copper plating thick copper alumina circuit board hole filling pcb plate

Product Details

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