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2-Layer HDI PCB Precision FR4 Smart Toy & IoT Controller

Place of origin: China
Material: FR-4
Board thickness: 0.2mm-6mm
Offer:
Range of copper thickness: 0.5oz-12oz

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HDI PCB Process Specification

Process Specification

1. Base Material: FR‑4

2. Layer: 4‑20 Layers

3. Board Thickness: 0.2mm‑6mm

4. Copper Thickness: 0.5oz‑12oz(18 μm ‑ 420 μm)

5. Surface Finish: HASL/ENIG (Gold)/ OSP/Immersion Gold

6. Solder Mask: Green/White/Red/ Blue/Black

7. Silkscreen: White/Black/Yellow Min.

8. Trace Width/Space: 3mil/3 mil（0.075mm）

9. Min. Hole Size: 0.1mm (CNC Drilling) / 0.6mm (Punching)

10. Impedance Control: Available

11. Testing: 100% Electrical Test Certification: ISO9001 / UL /ISO14001/IATF16949/ RoHS

HDI PCB Application scenarios

1.Smartphone Mainboard

HDI PCB adopts blind and buried vias for highdensity routing, supporting compact layout and high-speed signal

transmission for flagship smartphones.

2.Smart Watch & Wearables

Ultra-fine HDI PCB minimizes board dimension, integrating sensors, Bluetooth and power management for miniaturized,

low-power wearable devices.

3.Automotive Electronics

Automotive-grade HDI PCB serves infotainment, instrument and radar modules, delivering high-density interconnection

with anti-vibration and wide-temperature stability.

4.Laptop & Tablet Mainboard

Thin-type HDI PCB enables high-speed interconnection among CPU and memory, realizing component dense layout

for slim, high performance portable devices.

HDI PCB Production Line

Contact Us

Email: sales1@xdpcba.com

sales4@xdpcba.com

sales@xdpcba.com

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