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Process Specification
1. High Integration: 8-layer HDI structure for compact POS designs.
2. Stable Signal: Optimized EMI shielding for secure transactions.
3. Reliable OEM: Precision laser drilling for 0.05mm trace accuracy.
1.Smartphone Mainboard
HDI PCB adopts blind and buried vias for high-density routing, supporting compact layout and high-speed signal
transmission for flagship smartphones.
2.Smart Watch & Wearables
Ultra-fine HDI PCB minimizes board dimension, integrating sensors, Bluetooth and power management for miniaturized,
low-power wearable devices.
3.Automotive Electronics
Automotive-grade HDI PCB serves infotainment, instrument and radar modules, delivering high-density interconnection
with anti-vibration and wide-temperature stability.
4.Laptop & Tablet Mainboard
Thin-type HDI PCB enables high-speed interconnection among CPU and memory, realizing component dense layout
for slim, high performance portable devices.
1.Smartphone Mainboard
HDI PCB adopts blind and buried vias for high-density routing, supporting compact layout and high-speed signal
transmission for flagship smartphones.
2.Smart Watch & Wearables
Ultra-fine HDI PCB minimizes board dimension, integrating sensors, Bluetooth and power management for miniaturized,
low-power wearable devices.
3.Automotive Electronics
Automotive-grade HDI PCB serves infotainment, instrument and radar modules, delivering high-density interconnection
with anti-vibration and wide-temperature stability.
4.Laptop & Tablet Mainboard
Thin-type HDI PCB enables high-speed interconnection among CPU and memory, realizing component dense layout
for slim, high performance portable devices.
Contact us for any help regarding HDI PCB
Email: sales1@xdpcba.com
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sales@xdpcba.com
Quote Whether is a product enquiry or technical help, please send messager here, our team will respond within 24-48 hours
Our 8-layer HDI PCBs are the premier interconnect solution for high-end automotive applications, including autonomous driving controllers and advanced infotainment hubs. Featuring high-order laser micro-via structures, these boards support the massive data processing required for real-time sensor fusion and vehicle-to-everything (V2X) communication.
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Engineered for mission-critical defense systems, this 8-layer High-Frequency PCB provides exceptional signal integrity and extreme durability. The advanced multilayer stack-up is optimized for electromagnetic isolation and superior thermal management, ensuring stable performance in high-vibration and wide-temperature environments. Ideal for military radar, secure communications, and aerospace electronics, this board meets the most rigorous industrial standards for reliability.
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Designed for RFID/5G, this 2-layer HF PCB uses Rogers 4000 & Arlon AD for low loss & stable impedance to 6GHz. HASL offers solderability & cost. Supports antennas & PAs, phase-stable. For sensors, precise stacking cuts parasitic capacitance, boosts speed, lowers jitter. Tested for thermal/peel, meets auto/medical. Upgrades single-layer, ideal for proto & volume, ensures repeatability & easy supply.
Quote NowPrecision-engineered for the automotive electronics market, this 4-layer High-Frequency PCB delivers superior stability for vehicle-to-everything (V2X) and radar systems. It features a specialized multilayer stack-up that optimizes signal paths while maintaining excellent thermal management in harsh driving environments. Designed for high-speed data transmission and low signal interference, this board provides the durability and electrical accuracy required for modern smart driving.
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