HDI PCB Process Specification
Process Specification
1. Base Material: FR‑4
2. Layer: 4‑20 Layers
3. Board Thickness: 0.2mm‑6mm
4. Copper Thickness: 0.5oz‑12oz(18 μm ‑ 420 μm)
5. Surface Finish: HASL/ENIG (Gold)/ OSP/Immersion Gold
6. Solder Mask: Green/White/Red/ Blue/Black
7. Silkscreen: White/Black/Yellow
Min.
8. Trace Width/Space: 3mil/3 mil(0.075mm)
9. Min. Hole Size: 0.1mm (CNC Drilling) / 0.6mm (Punching)
10. Impedance Control: Available
11. Testing: 100% Electrical Test
Certification: ISO9001 / UL /ISO14001/IATF16949/ RoHS
HDI PCB Application scenarios
1.Smartphone Mainboard
HDI PCB adopts blind and buried vias for highdensity routing, supporting compact layout and high-speed signal
transmission for flagship smartphones.

2.Smart Watch & Wearables
Ultra-fine HDI PCB minimizes board dimension, integrating sensors, Bluetooth and power management for miniaturized,
low-power wearable devices.

3.Automotive Electronics
Automotive-grade HDI PCB serves infotainment, instrument and radar modules, delivering high-density interconnection
with anti-vibration and wide-temperature stability.

4.Laptop & Tablet Mainboard
Thin-type HDI PCB enables high-speed interconnection among CPU and memory, realizing component dense layout
for slim, high performance portable devices.

HDI PCB Production Line

Contact Us
Contact us for any help regarding HDI PCB
Email: sales1@xdpcba.com
sales4@xdpcba.com
sales@xdpcba.com