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Process Specification
1. High Integration: 8-layer HDI structure for compact POS designs.
2. Stable Signal: Optimized EMI shielding for secure transactions.
3. Reliable OEM: Precision laser drilling for 0.05mm trace accuracy.


1.Smartphone Mainboard
HDI PCB adopts blind and buried vias for high-density routing, supporting compact layout and high-speed signal
transmission for flagship smartphones.

2.Smart Watch & Wearables
Ultra-fine HDI PCB minimizes board dimension, integrating sensors, Bluetooth and power management for miniaturized,
low-power wearable devices.

3.Automotive Electronics
Automotive-grade HDI PCB serves infotainment, instrument and radar modules, delivering high-density interconnection
with anti-vibration and wide-temperature stability.

4.Laptop & Tablet Mainboard
Thin-type HDI PCB enables high-speed interconnection among CPU and memory, realizing component dense layout
for slim, high performance portable devices.

1.Smartphone Mainboard
HDI PCB adopts blind and buried vias for high-density routing, supporting compact layout and high-speed signal
transmission for flagship smartphones.

2.Smart Watch & Wearables
Ultra-fine HDI PCB minimizes board dimension, integrating sensors, Bluetooth and power management for miniaturized,
low-power wearable devices.

3.Automotive Electronics
Automotive-grade HDI PCB serves infotainment, instrument and radar modules, delivering high-density interconnection
with anti-vibration and wide-temperature stability.

4.Laptop & Tablet Mainboard
Thin-type HDI PCB enables high-speed interconnection among CPU and memory, realizing component dense layout
for slim, high performance portable devices.


Contact us for any help regarding HDI PCB
Email: sales1@xdpcba.com
sales4@xdpcba.com
sales@xdpcba.com
Quote Whether is a product enquiry or technical help, please send messager here, our team will respond within 24-48 hours