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Home > Products > PCB > Ceramic PCB > High Power LED Substrate Ceramic PCB Al2O3/AlN Board Fabrication

High Power LED Substrate Ceramic PCB Al2O3/AlN Board Fabrication

  • Place of origin: China
  • Material: Alumina (Al₂O₃ ≥96%) with white appearance for cost-effective solutions, or Aluminum Nitride (AlN ≥96%) with gray appearance for ultra-high thermal conductivity requirements
  • Board thickness: Al₂O₃: 0.25 ~ 2.0 mm; AlN: 0.38 ~ 1.5 mm
  • Offer: Leave your email to receive a discount coupon – we'll send it to you right away.
  • Range of copper thickness: 0.5oz-12oz(18μm - 420μm)
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Product Process Specifications

Material Options: Alumina (Al₂O₃ ≥96%) with white appearance for cost-effective solutions, or Aluminum Nitride (AlN ≥96%) with 

gray appearance for ultra-high thermal conductivity requirements

l Thermal Conductivity: Al₂O₃ ≥20 W/(m·K) / AlN ≥170 W/(m·K) – ensuring efficient heat dissipation for high-power stage 

lighting applications

l Flexural Strength: Al₂O₃ ≥350 MPa / AlN ≥450 MPa – providing mechanical robustness for large-size panel installation 

and transportation

l Volume Resistivity: Al₂O₃ ≥10¹⁴ Ω·cm / AlN ≥10¹³ Ω·cm – guaranteeing excellent electrical insulation under high-voltage 

operation

l Dielectric Performance: Dielectric constant of 8-10 at 1MHz with low dielectric loss (Al₂O₃ ≤3×10⁻⁴ / AlN ≤4.5×10⁻⁴) –

 ensuring signal integrity in high-frequency switching circuits

l Water Absorption: 0% – preventing moisture-related failures in humid stage environments

l Copper Metallization: DPC (Direct Plated Copper) process with customizable copper thickness for high-current carrying capacity

l Surface Finish: ENIG (Immersion Gold) for excellent solderability and oxidation resistance in long-term high-temperature operation

l Thermal Expansion Matching: Closely matched CTE (Coefficient of Thermal Expansion) with LED chips and power 

components, minimizing thermal stress and solder joint fatigue

l High-Temperature Stability: Sustained performance at operating temperatures up to 800°C for Al₂O₃ and even higher for AlN, 

suitable for high-intensity discharge (HID) lighting and moving head fixtures


Application Scenarios

1. High-Power Stage Lighting – Ceramic PCBs serve as the ideal substrate for high-power stage LED fixtures, moving 

head lights, and follow spots, providing superior thermal management to maintain brightness stability and extend LED 

lifespan during extended performances.

2. Automotive Electronics – Aluminum nitride (AlN) ceramic PCBs are ideal for electric vehicle power modules, IGBT heat 

sinks, and transmission system control boards, offering excellent thermal conductivity and high-voltage insulation for 

demanding automotive environments.

3. Aerospace & Defense – With high flexural strength (≥450 MPa) and extreme temperature resistance, ceramic PCBs are 

used in satellite communication systems, radar modules, and avionics equipment where reliability is critical.

4. Industrial Power Electronics – Ceramic heater PCBs and high-power rigid ceramic boards are applied in industrial heating 

equipment, power inverters, and welding machines, ensuring stable performance under high-temperature operation.

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Production Line & Manufacturing Capability

Our ceramic PCB manufacturing facility is equipped with advanced production lines including:

 

l DPC (Direct Plated Copper) process for high-precision metallization

 

l Thick-film printing and firing furnaces

 

l Laser cutting and precision drilling equipment

 

l Automatic optical inspection (AOI) and X-ray inspection systems

 

l ENIG (Electroless Nickel Immersion Gold) surface treatment line

 

Quality is ensured through 100% electrical testing, thermal cycling tests, and solderability tests in compliance with 

IPC-TM-650 and GB/T standards.

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Contact Us

Contact us for any help regarding Ceramic PCB fabrication and customization.

Website: www.xdpcba.com

Email: sales@xdpcba.com; bluesky@xdpcba.com


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