Product Process Specifications – Key Features for Medical Devices
1. Material System: High-purity alumina (Al₂O₃ ≥99.6%) – white, biocompatible and chemically inert; or aluminum nitride
(AlN ≥96%) – gray, offering ultra-high thermal conductivity up to 170 W/(m·K) for high-power medical electronics.
2. Biocompatibility Compliance: Materials meet ISO 10993 biological evaluation standards (cytotoxicity, sensitization,
irritation) – suitable for implantable devices and long-term patient-contact equipment.
3. Sterilization Resistance: Zero water absorption; withstands repeated autoclave sterilization (121°C steam), ethylene
oxide (EtO) gas, and gamma irradiation – no warping, moisture uptake, or degradation.
4. Electrical Safety & Insulation: Volume resistivity ≥10¹³ Ω·cm; fully compliant with IEC 60601 requirements for creepage,
clearance distances, and dielectric withstand voltage – ensuring patient and operator safety.
(Other standard parameters such as dielectric constant, flexural strength, and copper thickness are integrated into the
application descriptions below.)
Application Scenarios
1. Implantable Medical Devices – Pacemakers, cochlear implants, and neurostimulators rely on hermetic ceramic substrates
with decades-long reliability. Alumina provides inert, nontoxic performance for longterm implantation.
2. Diagnostic Imaging – Ultrasound transducer arrays, Xray detectors, and MRI gradient coil drivers use ceramic PCBs
for superior thermal management and highfrequency signal integrity (low dielectric loss up to 20 MHz).
3. Surgical Instruments – Electrosurgical generators and laser scalpels utilize highpower RF stages where ceramic PCBs
handle extreme thermal and voltage stresses, with high flexural strength (≥450 MPa) ensuring robustness under repeated
sterilization cycles.
4. Patient Monitoring & Lab Analysis – Precision sensor modules (temperature, pressure, biochemical) and DNA sequencers
leverage ceramic’s long-term dielectric stability, chemical resistance, and uniform heating performance.

Production Line & Manufacturing Capability
Our ceramic PCB manufacturing facility is equipped with advanced production lines including:
l DPC (Direct Plated Copper) process for highprecision metallization
l Thick-film screen printing and cofiring furnaces (up to 1000°C)
l Laser cutting and precision drilling equipment
l Automatic optical inspection (AOI) and Xray inspection systems
l ENIG (Electroless Nickel Immersion Gold) surface treatment line
l ISO 13485 certified quality management system
l Full material traceability from ceramic substrate lot to finished device
Quality is ensured through 100% electrical testing, thermal cycling tests, biocompatibility screening, and solderability tests in
compliance with IPC-TM-650, GB/T, ISO 10993, and IEC 60601-1 standards.

Contact Us
Contact us for any help regarding Medical Grade Ceramic PCB fabrication and customization.
Website: www.xdpcba.com
Email: sales@xdpcba.com;bluesky@xdpcba.com