PCB Instant Quote! 24-hour PCB production.
Quote Now
0755-27781532-8010; 02988446863
Home > Products > PCB > Special PCB > Medical Grade 8-Layer RF PCB ENIG Finish High Stability

Medical Grade 8-Layer RF PCB ENIG Finish High Stability

  • Place of origin: China
  • Material: FR-4,Rogers and Arlon
  • Board thickness: 0.2mm-6.0mm
  • Offer:
  • Range of copper thickness: 0.5oz-12.0oz
Quote Now

PCB Process

Item

Specifictions

Item

Specifictions

Base Material

FR-4,Rogers and Arlon

Silkscreen

White/Black/Yellow

Layer Count

1-38 Layers

Min. Trace Width/Space

3mil/3 mil(0.075mm)

Board Thickness

0.2mm-6mm

Min. Hole Size

0.1mm(CNC Drilling) / 0.6mm (Punching)

Copper Thickness

0.5oz-12oz(18μm - 420μm)

Impedance Control

Available

Surface Finish

HASL/ENIG(Gold)/OSP/Immersion Gold

Testing

 Electrical Test

Solder Mask

Green/White/Red/Blue/Black

Certification

ISO9001 / UL /ISO14001/IATF16949/ RoHS


PCB Application Scenarios

PCB Production Line

Cutting→ Drilling→ PTH → Copper Plating → Pre-treatment → Dry Film Lamination → Exposure→ Developing→ Etching

→Stripping →Surface Treatment→ Coverlay Lamination → Stiffener Attachment → Baking→ Silkscreen  → E-test  → 

Punching/Laser Cutting → Product → Packaging

Contact Us

Contact us for any help regarding Medical Grade 8-Layer RF PCB  ENIG Finish  High Stability

Website: www.xdpcba.com

Email: sales@xdpcba.com sales4@xdpcba.com


Quote Now

Quote Whether is a product enquiry or technical help, please send messager here, our team will respond within 24-48 hours

  • By submitting this form, you consent to the storage of your data and your interests in order to answer your enquiry. Further information on data processing, your rights and revocation can be found in our privacy policy.

  • Enter verification code

Related Products

  • High-Stability RFID PCB 6-Layer High-Frequency Multi-Layer

    High-Stability RFID PCB 6-Layer High-Frequency Multi-Layer

    Maximize your data accuracy with our 6-layer High-Frequency PCB, custom-engineered for high-density RFID applications. The advanced multilayer stack-up provides exceptional electromagnetic isolation, ensuring clean signal paths even in interference-heavy industrial environments. Designed for long-range sensitivity and rapid response, this board offers the thermal resilience and electrical precision necessary for smart logistics, automated inventory, and sophisticated IoT tracking systems.

    Quote Now
  • 8-Layer RF PCB for Smart Auto: High-Precision Impedance Control

    8-Layer RF PCB for Smart Auto: High-Precision Impedance Control

    Engineered for the future of autonomous driving and V2X systems, this 8-layer High-Frequency PCB provides unparalleled signal precision for complex automotive radar and telematics. The advanced multilayer structure optimizes thermal management and EMI shielding, ensuring reliable performance. With a focus on signal integrity and long-term durability, this board is the ideal foundation for high-speed data processing in smart vehicle electronics and safety-critical modules.

    Quote Now
  • 2-Layer HDI PCB  High-Density Board for Electronic Shelf Labels

    2-Layer HDI PCB High-Density Board for Electronic Shelf Labels

    Our 2-layer HDI PCBs are purpose-built for Electronic Shelf Labels (ESL) and smart retail display modules. Featuring advanced micro-via technology and an ultra-slim profile, these boards are optimized for low-power consumption and long-term battery efficiency. Designed to support E-ink displays and wireless communication (Zigbee/Bluetooth), our boards provide the high-density routing required for compact, energy-efficient retail hardware. We ensure superior signal integrity and surface flatness,

    Quote Now
  • 4-Layer High Frequency Antenna PCB circuit board at Low Loss designed for Impedance Control PCB

    4-Layer High Frequency Antenna PCB circuit board at Low Loss designed for Impedance Control PCB

    This professional 4-layer High Frequency PCB is designed for high-density antenna arrays and advanced RF systems. By integrating multi-layer architecture with low-loss materials, it offers superior signal shielding and thermal stability compared to standard boards. Engineered for precision, it supports stable transmission in complex microwave environments, making it the ideal choice for modern telecommunications, high-speed servers, and sophisticated radar modules.

    Quote Now