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4-Layer HDI PCB for RFID High-Gain RF Interconnect Solution

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HDI PCB Process Specification

Process Specification

1. Enhanced Range: 4-layer shielding for superior RF signal gain.

2. Compact Layout: High-density micro-vias for small-footprint designs.

3. Low Interference: Optimized stack-up for minimized EMI/EMC noise.

HDI PCB Application scenarios

1.Smartphone Mainboard

HDI PCB adopts blind and buried vias for high-density routing, supporting compact layout and high-speed signal

transmission for flagship smartphones.

2.Smart Watch & Wearables

Ultra-fine HDI PCB minimizes board dimension, integrating sensors, Bluetooth and power management for miniaturized,

low-power wearable devices.

3.Automotive Electronics

Automotive-grade HDI PCB serves infotainment, instrument and radar modules, delivering high-density interconnection

with anti-vibration and wide-temperature stability.

4.Laptop & Tablet Mainboard

Thin-type HDI PCB enables high-speed interconnection among CPU and memory, realizing component dense layout

for slim, high performance portable devices.

HDI PCB Production Line

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