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8-Layer AI Smart Glasses PCB High-Order HDI Wearable Tech

Place of origin: China
Material: FR4
Board thickness: 0.2mm-6mm
Offer:
Range of copper thickness: 0.5oz-12oz

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HDI PCB Process Specification

Process Specification

1. High-Speed AI: 8-layer routing for real-time vision & voice processing.

2. Extreme Slim: High-order HDI technology for ultra-thin wearable frames.

3. Pure Signal: Precision impedance control for low-latency AR/VR data

HDI PCB Application scenarios

1.Smartphone Mainboard

HDI PCB adopts blind and buried vias for high-density routing, supporting compact layout and high-speed signal

transmission for flagship smartphones.

2.Smart Watch & Wearables

Ultra-fine HDI PCB minimizes board dimension, integrating sensors, Bluetooth and power management for miniaturized,

low-power wearable devices.

3.Automotive Electronics

Automotive-grade HDI PCB serves infotainment, instrument and radar modules, delivering high-density interconnection

with anti-vibration and wide-temperature stability.

4.Laptop & Tablet Mainboard

Thin-type HDI PCB enables high-speed interconnection among CPU and memory, realizing component dense layout

for slim, high performance portable devices.

HDI PCB Production Line

Contact Us

Email: sales1@xdpcba.com

sales4@xdpcba.com

sales@xdpcba.com

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